​​​​​​​Applications

Chip-Crack Analysis

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Colourful colour gradient on the circuit board with black and orange components

  • For every element of the PCB the max. occurring strain is calculated and plotted in one contour plot​

  • The resulting contour plot therefore shows the worst possible strain that can occur

6 diagrams with bluish histograms

  • Probability of exceedance – limits are defined (e.g. 50%, 32%, 10%, 5%, 1%, 0%) ​

  • The maximum value of simulated PCB-strains can be determined for various probabilities of exceedance (50%, 32%, 10%, 5%, 1%, 0%)

Solder-Joint Analysis​

Discover our exemplary applications​​​​​​​

Shows 4 pictures: Top left: red PCB model with colour gradient for the SMDs. Top right: Coloured strain curve on fine FE mesh of a solder joint. Bottom left: 3 coloured curves in one diagram. Bottom right: Coloured horizontal bars and two black lines.


​​​​​​​Mapped damage values of all pins of the substitute FE-models (a). Damage values for a specific sub-model (marked by the white arrow in (a) in FEMFAT visualizer (b). Equivalent stress PSDs in the most damaged node of the sub-model (b) for all acceleration directions (c). Local S-N curve for the most damaged node of the sub-model (d).​

Thermo-Mechanical Analysis​

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The resulting power dissipation leads to an inhomogeneous heat up of the PCB. The Copper has a higher thermal conductivity than the FR4 and resin. ​​​​​​​

Grey circuit board with light blue areas

The inhomogeneous heat up of the PCB can lead to high strains and stresses in different regions of the PCBA. In this example the solder joints of the SMDs experience elasto-plastic stresses.

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